Low Temperature Co-fired Ceramic
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Low Temperature Co-fired Ceramic

Low Temperature Co-fired Ceramic is an advanced electronic ceramic material produced through ceramic green tape casting, conductor circuit printing, multilayer lamination, and single co-firing at temperatures below 900℃.
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Description

Technical Parameters

Product Introduction

 

Low Temperature Co-fired Ceramic is an advanced electronic ceramic material produced through ceramic green tape casting, conductor circuit printing, multilayer lamination, and single co-firing at temperatures below 900℃. 

 

Key Advantages

 

Low Dielectric Loss
LTCC features low dielectric constant and dielectric loss, significantly reducing high-frequency signal attenuation and crosstalk, and improving signal integrity.

Strong Multilayer Integration Capability
LTCC supports the embedding of resistors, capacitors, inductors, and complex conductor lines, enabling three-dimensional circuit design.

Excellent Thermal Stability
The material has a low coefficient of thermal expansion and good dimensional stability, allowing it to withstand long-term high and low temperature cycling.

 

LTCC vs Other Materials

 

Property

LTCC

HTCC

PCB

Firing Temperature

<900°C

>1600°C

-

High Frequency Performance

Excellent

Good

Moderate

Dielectric Loss

Low

Medium

High

Thermal Stability

Excellent

Excellent

Moderate

Miniaturization

Excellent

Good

Limited

Embedded Components

Yes

Limited

No

Signal Integrity

Excellent

Good

Moderate

 

Technical Specifications

 

Item

Typical Value

Material Type

LTCC Ceramic

Dielectric Constant (Dk)

5.5–10

Dielectric Loss (tanδ)

0.001–0.003

Thermal Conductivity

3–5 W/m·K

CTE

5.8–7.2 ×10⁻⁶/K

Layer Count

Up to 40+ Layers

Min. Line Width/Spacing

≤50 μm / 50 μm

Min. Via Diameter

≥75 μm

Metallization

Ag / Au / Cu

Flexural Strength

≥230 MPa

Operating Temperature

-65°C to +250°C

Surface Roughness

≤0.3 μm

Dimensions

Custom

 

Customization Services

 

Material System Customization: Supports design of materials with different dielectric constants, thermal conductivity, and coefficients of thermal expansion.

Multilayer Structure Customization: Supports development of different numbers of layers, thicknesses, and complex 3D wiring structures.

Metallization Solution Customization: Provides conductor systems such as Ag, Au, and Cu, as well as surface treatment solutions.

RF Performance Optimization: Collaborative design based on operating frequency, loss requirements, and application environment.

OEM/ODM Development: Supports one-stop service from material selection, structural design, sample development to mass production.

 

Applications

 

5G Communication: Used for base station antennas, RF front-ends, and millimeter-wave communication modules.

Automotive Radar: Used for 77GHz automotive millimeter-wave radar packaging and antenna systems.

GPS Antennas: Used for navigation, positioning, and satellite communication equipment.

IoT Devices: Suitable for highly integrated wireless communication terminals.

Aerospace Electronics: Meets the requirements of high-reliability aerospace electronic systems.

Industrial Sensors: Suitable for industrial automation and intelligent sensing systems.

 

Quality Assurance

 

Raw Material Inspection: Rigorous testing is conducted on the purity, particle size, and key properties of raw materials.

Process Quality Control: Online monitoring and data traceability are implemented for key processes to ensure process stability.

Finished Product Reliability Verification: Dielectric performance, high and low temperature cycling, thermal shock, X-ray, and airtightness testing are performed to ensure long-term reliable product operation.

 

Company Strength

 

20+ Years Manufacturing Experience
Founded in 2003, specializing in the R&D and manufacturing of inorganic new materials, with over 20 years of industry experience.

Stable Production Capability
Possesses a large-scale production base and a complete manufacturing system, supporting long-term stable procurement from global clients.

Professional R&D Team
Has material R&D and performance optimization capabilities, providing customized solutions.

Strict Quality Control
Equipped with advanced testing equipment, strictly controlling product quality and batch stability.

Global Export Experience
Products are exported to overseas markets, with mature export services and customer support capabilities.

Customized Solutions
Supports customization of product specifications, performance, and application requirements to meet diverse customer needs.

 

FAQ

 

Q: What is the difference between LTCC and HTCC?

A: LTCC has a lower sintering temperature, can use highly conductive metal systems, and has superior high-frequency performance.

Q: Which metallization schemes are supported?

A: Ag, Au, Cu, and other conductor systems are available.

Q: Can you provide custom designs?

A: Customization of materials, number of layers, circuit structure, and dimensions is supported.

Q: Can you provide samples?

A: R&D samples and small-batch trial production are supported.

Q: What is the minimum order quantity?

A: There is no strict MOQ limit for standard products; it depends on the product specifications.

Q: How long is the product lead time?

A: Samples typically take 3–4 weeks, and bulk orders generally take 4–6 weeks.

Q: What trade terms are supported?

A: EXW, FOB, CIF, DDP, and other international trade methods are supported.

Q: How do you ensure batch consistency?

A: We ensure stable product supply through standardized process management and full-process quality control.

Q: Which industries are your products mainly used in?

A: Widely used in 5G communications, automotive electronics, aerospace, industrial electronics, and sensors.

Q: Does the manufacturer support OEM/ODM projects?

A: We support one-stop customized services from R&D design to mass production delivery.

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