Description
Technical Parameters
Product Overview
Quasi Spherical Alumina is a high-performance thermal conductive filler produced from high-purity ultra-fine alumina through high-temperature single-crystal growth, purification, and precision dispersion processes.
Technical Specifications
|
Index |
Unit |
ZC-D01L |
|
D10 |
Μm |
0.701 |
|
D50 |
Μm |
1.091 |
|
D90 |
Μm |
1.679 |
|
D100 |
Μm |
3.170 |
|
Specific Surface Area |
M²/g |
2.3210 |
|
Conductivity |
ΜS/cm |
60.5 |
|
PH |
- |
9.48 |
|
Moisture Content |
% |
0.15 |
|
Α Phase Conversion Rate |
% |
96 |
|
Purity (Al₂O₃) |
% |
≥99.9 |
|
Na |
Ppm |
386.06 |
|
Fe |
Ppm |
88.53 |
|
Si |
Ppm |
187.83 |
Key Features
High α-Phase Content
α-phase conversion rate of 96% provides a stable crystal structure and efficient thermal conductivity.
High Purity Alumina
Al₂O₃ purity ≥99.9% with controlled impurity levels supports stable performance in electronic and thermal applications.
Controlled Particle Distribution
Uniform particle size distribution improves packing efficiency, dispersion, and consistency in resin systems.
Low Specific Surface Area
Specific surface area of 2.3210 m²/g supports high filler loading while maintaining processing fluidity.
Uniform Crystal Morphology
Single-crystal growth technology provides consistent particle characteristics for stable composite performance.
Effective Heat Transfer Performance
High crystallinity and optimized particle structure help build efficient thermal conduction pathways.
Typical Applications
Thermal Interface Materials
Used in thermal pads, thermal grease, sealing adhesives, and phase change materials requiring efficient heat transfer.
Thermal Conductive Silicone Products
Applied in silicone gaskets and thermal interface compounds requiring high filler loading and stable processing.
Thermal Engineering Plastics
Suitable for LED components, electronic housings, switch housings, and heat dissipation parts.
Electronic Heat Dissipation Components
Used in thermal management materials for electronic devices and electrical systems.
Copper-Clad Panel Materials
Applied as a thermal conductive filler for copper-clad laminate systems.
Advanced Ceramic Applications
Used in high-purity alumina ceramic applications requiring controlled powder characteristics.
Quality Control & Material Testing Support
ZC-TECH applies professional testing methods to evaluate chemical composition, particle characteristics, and powder performance.
Chemical Composition Analysis
ICP-OES testing verifies Al₂O₃ purity and impurity elements including Na, Fe, and Si.
Particle Size Analysis
Laser particle size testing monitors D10, D50, D90, and D100 distribution for material consistency.
Crystal Phase Evaluation
Phase analysis verifies α-phase conversion rate to support stable thermal performance.
Powder Property Testing
Specific surface area, moisture content, conductivity, and pH testing evaluate application-related powder properties.
Morphology Evaluation
SEM analysis supports particle structure evaluation and material consistency verification.
Why Choose Us?
20+ Years of Advanced Material Manufacturing Experience
Established in 2003, ZC-TECH specializes in the development and production of advanced inorganic functional materials.
Integrated Material Development Capability
ZC-TECH combines alumina research, powder processing, manufacturing, and application support for industrial customers.
Strict Quality Management System
ISO 9001:2015 certified processes ensure standardized production control and stable material performance.
Professional R&D and Testing Support
Advanced analysis equipment and technical teams support material development, testing, and performance verification.
Application-Oriented Alumina Development
ZC-TECH develops alumina powders with controlled particle characteristics for thermal management and electronic material applications.
Global Supply Experience
ZC-TECH supplies international customers across markets including India, South Korea, Türkiye, Russia, Spain, and other regions.
FAQ
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