Quasi Spherical Alumina
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Quasi Spherical Alumina

Quasi Spherical Alumina is a high-performance thermal conductive filler produced from high-purity ultra-fine alumina through high-temperature single-crystal growth, purification, and precision dispersion processes.
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Description

Technical Parameters

Product Overview

 

Quasi Spherical Alumina is a high-performance thermal conductive filler produced from high-purity ultra-fine alumina through high-temperature single-crystal growth, purification, and precision dispersion processes. 

 

Technical Specifications

 

Index

Unit

ZC-D01L

D10

Μm

0.701

D50

Μm

1.091

D90

Μm

1.679

D100

Μm

3.170

Specific Surface Area

M²/g

2.3210

Conductivity

ΜS/cm

60.5

PH

-

9.48

Moisture Content

%

0.15

Α Phase Conversion Rate

%

96

Purity (Al₂O₃)

%

≥99.9

Na

Ppm

386.06

Fe

Ppm

88.53

Si

Ppm

187.83

 

Key Features

 

High α-Phase Content
α-phase conversion rate of 96% provides a stable crystal structure and efficient thermal conductivity.
High Purity Alumina
Al₂O₃ purity ≥99.9% with controlled impurity levels supports stable performance in electronic and thermal applications.
Controlled Particle Distribution
Uniform particle size distribution improves packing efficiency, dispersion, and consistency in resin systems.
Low Specific Surface Area
Specific surface area of 2.3210 m²/g supports high filler loading while maintaining processing fluidity.
Uniform Crystal Morphology
Single-crystal growth technology provides consistent particle characteristics for stable composite performance.
Effective Heat Transfer Performance
High crystallinity and optimized particle structure help build efficient thermal conduction pathways. 

 

Typical Applications

 

Thermal Interface Materials
Used in thermal pads, thermal grease, sealing adhesives, and phase change materials requiring efficient heat transfer.
Thermal Conductive Silicone Products
Applied in silicone gaskets and thermal interface compounds requiring high filler loading and stable processing.
Thermal Engineering Plastics
Suitable for LED components, electronic housings, switch housings, and heat dissipation parts.
Electronic Heat Dissipation Components
Used in thermal management materials for electronic devices and electrical systems.
Copper-Clad Panel Materials
Applied as a thermal conductive filler for copper-clad laminate systems.
Advanced Ceramic Applications
Used in high-purity alumina ceramic applications requiring controlled powder characteristics. 

 

Quality Control & Material Testing Support

 

ZC-TECH applies professional testing methods to evaluate chemical composition, particle characteristics, and powder performance.


Chemical Composition Analysis
ICP-OES testing verifies Al₂O₃ purity and impurity elements including Na, Fe, and Si.
Particle Size Analysis
Laser particle size testing monitors D10, D50, D90, and D100 distribution for material consistency.
Crystal Phase Evaluation
Phase analysis verifies α-phase conversion rate to support stable thermal performance.
Powder Property Testing
Specific surface area, moisture content, conductivity, and pH testing evaluate application-related powder properties.
Morphology Evaluation
SEM analysis supports particle structure evaluation and material consistency verification. 

 

Why Choose Us?

 

20+ Years of Advanced Material Manufacturing Experience
Established in 2003, ZC-TECH specializes in the development and production of advanced inorganic functional materials.
Integrated Material Development Capability
ZC-TECH combines alumina research, powder processing, manufacturing, and application support for industrial customers.
Strict Quality Management System
ISO 9001:2015 certified processes ensure standardized production control and stable material performance.
Professional R&D and Testing Support
Advanced analysis equipment and technical teams support material development, testing, and performance verification.
Application-Oriented Alumina Development
ZC-TECH develops alumina powders with controlled particle characteristics for thermal management and electronic material applications.
Global Supply Experience
ZC-TECH supplies international customers across markets including India, South Korea, Türkiye, Russia, Spain, and other regions. 

 

FAQ

 

Q: What is Quasi Spherical Alumina used for?

A: It is mainly used as a thermal conductive filler for thermal interface materials, silicone thermal products, thermal engineering plastics, and copper-clad panels.

Q: What advantages does Quasi Spherical Alumina provide in thermal applications?

A: High α-phase content, high purity, controlled particle distribution, and uniform morphology support efficient thermal transfer and stable processing performance.

Q: Which resin systems are suitable for this product?

A: It is suitable for silicone, epoxy resin, thermal conductive adhesives, phase change materials, and other polymer systems requiring alumina fillers.

Q: Can ZC-TECH provide customized alumina powder solutions?

A: Yes. Powder characteristics can be adjusted according to application requirements, including particle size distribution and material properties.

Q: How should customers select the suitable grade?

A: Selection depends on resin system, thermal conductivity target, filler loading requirement, processing method, and viscosity control needs.

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